Additionally, elements in the drawing figures are not necessarily drawn to scale. 2 as operated according to an embodiment of the invention.For simplicity and clarity of illustration, the drawing figures illustrate the general manner of construction, and descriptions and details of well-known features and techniques may be omitted to avoid unnecessarily obscuring the discussion of the described embodiments of the invention. 6 is a side view of the piezoelectric fan of FIG. 1 as operated according to an embodiment of the invention andįIG. 5 is a side view of the piezoelectric fan of FIG. 4 is a flowchart illustrating a method of cooling a microelectronic device according to an embodiment of the invention įIG. 3 is an elevational view of a cooling device containing a piezoelectric fan according to an embodiment of the invention įIG. 2 is a plan view of a piezoelectric fan according to another embodiment of the invention įIG.
1 is a plan view of a piezoelectric fan according to an embodiment of the invention įIG.
The disclosed embodiments will be better understood from a reading of the following detailed description, taken in conjunction with the accompanying figures in the drawings in which:įIG. This airflow carries heated air away from high temperature regions, placing it at cooler regions where its effect will not be problematic, and draws cooler air in to the high temperature regions to take the place of the heated air that is removed.BRIEF DESCRIPTION OF THE DRAWINGS One method of dissipating heat is to cause air to flow across regions of elevated temperature. Microelectronic devices generate heat during their operation, and this heat must be safely dissipated in order to improve reliability and performance and to prevent premature failure. The disclosed embodiments of the invention relate generally to thermal management of microelectronic devices, and relate more particularly to piezoelectric cooling fans.